Low temperature co-fired ceramic substrate with embeded capacitors

Número de publicación: US20150122536A1
Fecha de publicación: 7 de mayo de 2015
Solicitante:   Samsung Electro-mechanics Co.

The present invention relates to a low temperature co-fired ceramic substrate with embedded capacitors. According to an embodiment of the present invention, the low temperature co-fired ceramic substrate with embedded capacitors is able to prevent diffusion, peeling or loss of electrodes after low temperature firing by controlling composition ratio of various metals included in the substrate, resulting in good adhesion between the ceramic substrate and the capacitor.

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