N. pub: US 2013/0087952 A1
Assignee: FIH (HONG KONG) LIMITED (Kowloon, HK) ; SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD. (ShenZhen City, CN)
A method for making a housing of an electronic device includes applying a layer of ceramic powder material to an outer surface of a metal substrate. The layer of ceramic powder material and a top layer of the metal substrate are melted by laser irradiation, forming a ceramic-metal composite coating integrally bonding with the metal substrate when cooled. The substrate with the ceramic-metal composite coating is heated to apeak temperature, maintained at the peaktemperature for a desired period of time, and then cooled down to room temperature. The heat treated metal substrate with the ceramic-metal composite coating is then formed into a desired shape.
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Assignee: FIH (HONG KONG) LIMITED (Kowloon, HK) ; SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD. (ShenZhen City, CN)
A method for making a housing of an electronic device includes applying a layer of ceramic powder material to an outer surface of a metal substrate. The layer of ceramic powder material and a top layer of the metal substrate are melted by laser irradiation, forming a ceramic-metal composite coating integrally bonding with the metal substrate when cooled. The substrate with the ceramic-metal composite coating is heated to apeak temperature, maintained at the peaktemperature for a desired period of time, and then cooled down to room temperature. The heat treated metal substrate with the ceramic-metal composite coating is then formed into a desired shape.
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