Pub. No.: WO/2014/059798
International Application No.: PCT/CN2013/078180
Applicants: FUDAN UNIVERSITY [CN/CN]; No.220 HanDan Road, YangPu Area Shanghai 200433 (CN)
Inventors: DENG, Dunying; (CN). XIAO, Fei; (CN)
Agent: SHANGHAI CHENHAO INTELLECTUAL PROPERTY LAW FIRM GENERAL PARTNERSHIP; Room202B, Building No.2 787 zhizaoju Road, Huangpu District Shanghai 200011 (CN)
Abstract: A nano-copper ink and copper conductive film preparation method, comprising: dispersing nano-copper in ethanol containing short-chain hydroxyl carboxylic acid, or in ethylene glycol or in the mixed solution of the ethanol and the ethylene glycol to obtain the nano-copper ink; then coating the nano-copper ink onto the surface of a substrate; and baking at a low temperature to form the copper conductive film. The addition of the short-chain hydroxyl carboxylic acid solves the problem of the nano-copper being likely to be oxidized in the dispersing, printing and baking process.