Solicitante: MURATA MANUFACTURING Co.
N. de solicitud: US20050201965
N. de publicación: US2006231980
A separable die including a plurality of molding through holes is disposed in a recess in a cavity of a molding die. Slurry containing a ceramic powder and a solvent is supplied in the cavity. The slurry in the cavity is then pressed into the molding holes of the separable die by pressure due to a movement of a punch. Excess solvent is removed by suction by a stage for suction dewatering provided at the rear of the separable die thereby forming green compacts in the molding holes. Subsequently, the separable die is removed from the molding die. The green compacts are released from the molding holes of the separable die in a separate state.
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