Solicitante: TOKUYAMA CORP (JP)
N. de solicitud: EP20050816735
N. de publicación: EP1829848
The process for producing a metallized ceramic substrate of the present invention comprises a step of preparing a raw material substrate comprising a ceramic substrate which may have on its surface a conductive layer or a conductor paste layer, a step of preparing a metallized ceramic substrate precursor, said step comprising a step of forming a ceramic paste layer on the raw material substrate and a step of forming a conductive paste layer on the ceramic paste layer, and a step of firing the metallized ceramic substrate precursor obtained in the previous step. In the step, formation of a ceramic paste layer and formation of a conductive paste layer may be alternately repeated plural times. According to the present invention, running or spreading of the conductive paste is prevented, and a metallized ceramic substrate which has a high degree of freedom of wiring design and high reliability and has a fine metallization pattern can be produced.
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